DOWSIL TC-5888 Thermally Conductive Compound
Product Overview

Dow Corning TC-5888 is a silicone-based thermal compound engineered to provide efficient heat transfer between electronic devices and their cooling components. It contains zinc oxide fillers uniformly dispersed in a non-curing silicone matrix, ensuring consistent thermal performance and long-term stability. The compound remains soft and non-melting under extended service conditions, making it suitable for both manual and automated application methods.

Key Specifications

Applications

• CPU and power transistor mounting—enhances heat dissipation to heat sinks.

• LED modules—maintains stable junction temperature during continuous operation.

• Power converters and amplifiers—improves reliability through efficient heat transfer.

• Automotive electronic control units—ensures thermal management under vibration and heat cycling.

• Sensors and rectifiers—provides consistent interface thermal performance.

Features & Benefits

• Silicone-based formulation for durable thermal interface performance.

• Non-curing and non-melting consistency ensures easy rework and long service life.

• Excellent dielectric insulation for high-voltage electronic assemblies.

• Maintains uniform thermal conductivity over wide temperature ranges.

• Low oil bleed and minimal evaporation for stable operation.

• Chemically compatible with most metals and plastics.

• Suitable for syringe or spatula application.

Safety & Storage / Handling

Handle with adequate ventilation and standard PPE. Avoid prolonged skin contact. Store in a cool, dry location away from direct sunlight and ignition sources. Keep container tightly sealed when not in use.

Category

Thermally conductive silicone grease